Microelectromechanical Components for Miniaturized Low-Power Communications

An overview of recent progress in the research and development of microelectromechanical devices for use in wireless communication sub-systems is presented. Among the specific devices described are tunable micromachined capacitors, integrated high-Q inductors, and micro-scale vibrating mechanical resonators with Q’s in the tens of thousands. Specific applications are reviewed for each of these components with emphasis on methods for miniaturization and performance enhancement of existing and future wireless transceivers.